Oso Semiconductor Closes $5.2M Seed Round.
Business Wire
We are investing in the development and integration of multi-systems and technology, like advanced computing, mobility, and the built environment, that will create more effective, productive, and inclusive foundational technology for industrial systems.
“We will need to rethink the foundations upon which our systems and world are built in order to prepare for our growing populations and biggest challenges of the next 50 years. From compute power to manufacturing to new means of transport, advances here will be necessary for all sectors to move forward.”
Reed Sturtevant Engine Ventures ![]()
Optical interconnect for semiconductors. A Photonic Fabric for chip-to-chip and on-chip data movement.
Revolutionizing Phased Array Antennas with Novel Chip Designs.
Bringing new intelligence to industrial robots.
Engineering the next generation step-change in compute.
A secure, resilient operating system, designed for the cloud computing era.
Next generation of super metal alloys, enabling a critical step to the energy transition.
A materials breakthrough to eliminate the climate impact of cooling.
Ultra-efficient optical circuits to de-bottleneck data centers and telecom networks.
Generating diverse genomes to scale and digitalize biomanufacturing.
Powering the future of public transit.
Reinventing the architecture of electricity transmission to enable a fully decarbonized grid.
Optimizing the resources at the heart of every cloud computation.
Automating the logistics industry with a humanistic AI-powered autonomous driving system.
Significantly more efficient electronics: from cell towers to data centers.
Enabling the next era of fully electrified heavy machinery.
Applying a fundamental mathematical insight to the problem of turbulence.
Using wireless charging to unlock new opportunities in mobility and medicine.
Creating beautiful, intelligent, and scalable building systems that raise the standards of low-to-high rise construction.
Using fluorescence to unlock new layers of information.
Revolutionizing Phased Array Antennas with Novel Chip Designs.
Bringing new intelligence to industrial robots.
Generating diverse genomes to scale and digitalize biomanufacturing.
A secure, resilient operating system, designed for the cloud computing era.
A materials breakthrough to eliminate the climate impact of cooling.
Applying a fundamental mathematical insight to the problem of turbulence.
Engineering the next generation step-change in compute.
Next generation of super metal alloys, enabling a critical step to the energy transition.
Protecting and restoring natural ecosystems, one plant cell at a time.
Using wireless charging to unlock new opportunities in mobility and medicine.
Cost-effective, zero-carbon cement produced via electrochemistry.
Reinventing the architecture of electricity transmission to enable a fully decarbonized grid.
Powering the future of public transit.
Optical interconnect for semiconductors. A Photonic Fabric for chip-to-chip and on-chip data movement.
Creating beautiful, intelligent, and scalable building systems that raise the standards of low-to-high rise construction.
Enabling the next era of fully electrified heavy machinery.
Optimizing the resources at the heart of every cloud computation.
Ultra-efficient optical circuits to de-bottleneck data centers and telecom networks.
Industrial Generative AI for Industrial-Scale Problems.
Significantly more efficient electronics: from cell towers to data centers.
Automating the logistics industry with a humanistic AI-powered autonomous driving system.
Using fluorescence to unlock new layers of information.